New Orbotech Corus™ Offers Double-sided Imaging For High-Density Interconnect PCBs And IC Substrates | Innovation

The new Orbotech Corus™ 8M direct imaging (DI) system is the primary resolution constructed on KLA’s all-in-one revolutionary Orbotech Corus platform, combining optimized decision, accuracy and effectivity for PCB producers designing smaller, thinner gadgets for OEMs ever growing performance in more and more smaller packages for top efficiency purposes.

“Premium smartphones exemplify the trend towards increased capabilities along with slimmer, compact designs that cannot be achieved without major improvements to PCBs and IC substrates. DI technology plays a major role in this shift, and our all-in-one Orbotech Corus platform will produce the precise, super-fine features required for these evolving technology innovations with greater capacity and efficiency.”

Arik Gordon, Managing Director, LIS Division, KLA

Manufacturers use DI expertise to provide superior PCBs and IC substrates designed with extraordinarily skinny conductors and transmission strains. These copper traces should be shaped with excessive precision because the circuit density will increase and the spacing between the strains decreases.

“This is no easy feat given the inherent challenges of defining, shaping and handling these delicate circuits at high production throughput,” says Gordon. “Our engineering team developed the extensible Orbotech Corus platform as an innovative, fully automated, two-sided system to provide the direct imaging needed to accelerate a wide range of industrial and communications applications that rely on high-density production interconnect PCBs and IC substrates.”

Orbotech Corus Is A Leap Ahead In DI Expertise

KLA designed the Orbotech Corus 8M direct imaging system to ship higher efficiency by way of improved accuracy and effectivity:

All-in-one To Extend Effectivity And Yield

Orbotech Corus DI programs function Double-Sided Imaging (DSI™) expertise, an business first that allows imaging of each side of the PCB panel, eliminating the necessity for a number of unbiased DI, loader /unloader and flipper programs. This signifies that a single, absolutely automated Orbotech Corus 8M DI system can successfully exchange a whole DI manufacturing line.

KLA’s new Orbotech Corus direct imaging system (left) can exchange a conventional DI line.

This all-in-one strategy to direct imaging delivers further advantages reminiscent of elevated capability per sq. meter in a bodily footprint that saves precious cleanroom area. While a traditional DI line would possibly measure about 18 sq. meters, an Orbotech Corus 8M DI system reduces this footprint to virtually 10 sq. meters.

The absolutely built-in system reduces the danger of contamination by together with built-in cleaners and filters, all in a closed, compact “box” that helps producers present a clear setting all through the system. Manufacturers will see even increased ranges of cleanliness within the instrument publicity space to keep up excessive yield ranges.

High Accuracy And Exact Imaging For Improved Tremendous Line Sample High Quality

Orbotech Corus 8M DI programs considerably enhance field-proven Large Scan Optics (LSO™) and MultiWave™ laser applied sciences by utilizing a extra highly effective laser and extra superior optics. This optimized optical path allows excessive depth of area (DOF) for improved line precision and uniformity on various floor topographies, and LSO expertise makes use of a single imaging approach for increased picture high quality. These enhancements are constructed into the revolutionary new high-precision platform and are supported by superior scaling algorithms, enabling the Orbotech Corus 8M system to attain finer resolutions – down to eight µm linewidth – and better registration accuracy of ±5 µm for superior purposes.

The ensuing capability of the Orbotech Corus 8M system is meant for large-scale manufacturing of IC substrates (modules, flip-chip ball grid array [FCBGA] core layers) and superior high-density interconnect (HDI) PCBs which are appropriate with a variety of superior course of varieties such because the modified semi-additive course of (mSAP), in addition to the tent-and-etch course of.

The capacity to provide ultra-fine strains with excessive accuracy makes Orbotech Corus 8M DI programs ideally fitted to excessive efficiency purposes, together with excessive efficiency smartphones and wearable gadgets reminiscent of smartwatches.

The superior goal recognition and scaling algorithms of the Orbotech Corus 8M system ship pinpoint picture accuracy for every sub-panel (unit degree) and supply full flexibility to learn any variety of targets with any goal format throughout the panel (together with goal uneven patterns) and any goal kind with minimal throughput loss to assist ship excessive productiveness.

Together As One

The Orbotech Corus direct imaging resolution takes its identify from the music lexicon.

“Just as a chorus of singers harmonizes individual parts into a rich, unified vocal texture, Orbotech Corus DI systems harmonize numerous modules and components into a single system to achieve higher quality, yield and efficiency, supporting continued innovation for PCBs and IC substrates,” says Gordon.

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