In current years, the function of semiconductor packaging has developed to turn out to be an necessary issue within the digital age.
Packaging manufacturing was once only a technique of defending chips and electrically connecting them, however now performs a extra central function in bettering gadget efficiency and capabilities. As transistor scaling turns into much more sophisticated and costly, packaging has turn out to be an alternate manner to offer sooner efficiency, new performance, decreased energy consumption, and customized design shapes.
Packaging innovation has resulted within the in depth use of heterogeneous integration combining several types of chips right into a single bundle, in addition to characteristic dimension discount and the usage of numerous 2D and 3D integration schemes. These modifications enhance efficiency and performance, however typically end in elevated complexity and new ROI challenges.
“Finding ways to overcome quality and yield challenges has always been part of developing innovative technology. Imagine having to throw away an expensive multi-chip package because one of the integrated chips failed. This will lead to additional screening inspections prior to final package integration. At KLA, we have a history of supporting semiconductor technology bends with process control, and combining this experience with our broad range of yield-enhancing process, inspection and metrology systems makes us an ideal partner for packaging manufacturers seeking new technologies .”
Oreste Donzella, govt vice chairman, electronics, packaging and parts (EPC) group, KLA
KLA’s complete portfolio of packaging options accelerates the manufacturing course of for outsourced semiconductor meeting and check (OSAT) suppliers, gadget producers, foundries and IC substrate producers for all kinds of packaging functions. Learn extra about our packaging course of management and course of help options for wafers, packaged parts and IC substrates at kla.com/merchandise/packaging-manufacturing.
Source: www.kla.com